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SST and SK hynix system ic partner to expand availability of embedded SuperFlash technology

IC designers are increasingly seeking ways to keep production costs down while implementing low power, high endurance embedded flash. Microchip Technology Inc. via its subsidiary Silicon Storage Technology (SST) has announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology. The partnership will introduce SST’s embedded SuperFlash technology to SK hynix system ic’s 110 nanometer (nm) CMOS platform, providing designers a cost-effective and low-power embedded flash memory solution. 

SST’s embedded SuperFlash technology offers low power, high reliability, superior data retention and endurance for a range of applications, such as Internet of Things (IoT) devices, smart cards and microcontroller-based applications. The technology’s power efficiency and fast erase time are ideal for low-power applications such as remote IoT edge nodes and contactless payment devices. 

 “The combination of area-efficient, low-power SuperFlash technology and the highly cost-effective 110 nm process node opens up exciting new product opportunities, especially for IoT and microcontroller-based applications,” said Mark Reiten, vice president of SST, a wholly owned subsidiary of Microchip. “This partnership will enable customers who require low power, high endurance embedded flash to keep their production costs down by using the highly optimised 8-inch CMOS platform.”

SST’s SuperFlash technology complements SK hynix system ic’s embedded flash memory solutions with low power and high reliability IP. SK hynix system ic is a fully owned subsidiary spun off from SK hynix (000660: Korea SE) in July 2017. It is a pure 200 mm foundry specialised in Display Driver IC (DDI), CMOS Image Sensor (CIS), and Power IC with a process range of 500 nm to 57 nm. 

“We believe that the adoption of SST’s embedded SuperFlash will enable SK hynix system ic to expand our technology portfolio, and it will help to respond to customer requests for highly reliable and robust embedded non-volatile memory solutions,” said Dr. SB You, marketing vice president of SK hynix system ic. “Moreover, we will provide customers with a cost-effective embedded flash solution to support their competitiveness in the market. As the demand for embedded flash memory solutions increases, there will be many customers coming to us to use our 110nm CMOS technology-based embedded flash memory solution.” 

The process development commenced earlier this year and is expected to be completed in early 2019. Contact SST for more information on the company’s extensive custom library of off-the-shelf IP blocks optimised for smartcard System-on-Chips (SoCs). 

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FO-WLP panel production becomes a reality

Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications. The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC. Future applications under consideration for panel production include application processors, memory and RF modules. TechSearch International, Inc. details these applications and analyzes monthly panel requirements and planned capacity. Supplier plans are discussed and consortia activities are highlighted.

One of the major market trends in wearable electronics is the shift to smartwatches, which have surpassed shipment numbers for wristbands. Package trends for wearable electronic products are analyzed, including Apple’s new smartwatch using TSMC’s InFO and Samsung’s Galaxy using FOPLP. The latest trends in augmented reality (AR) and virtual reality (VR) headsets are discussed. A detailed analysis of the change in packages from the previous generation HTC Vive VR system is presented.

A detailed analysis of the OSAT financials is provided with regional growth documented. Board and substrate material requirements for 5G applications are presented.

The latest Advanced Packaging Update is a 45-page report with full references and an accompanying set of 46 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on twitter @Jan_TechSearch

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Ferdinand-Braun-Institut chooses ClassOne for three additional wet processing tools

ClassOne Technology, global supplier of wet processing equipment for ≤200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany. In recent weeks, FBH ordered ClassOne’s high-performance 8-chamber Solstice® electroplating system. Now FBH is ordering three additional wet processing tools from ClassOne, including a refurbished Semitool®Spray Solvent Tool (SST), a Semitool Spray Acid Tool (SAT) and a Trident Spin Rinse Dryer (SRD). FBH is one of the world’s leading research institutes and a producer of III-V compound semiconductors, known for prototyping advanced microwave and optoelectronic devices for communications, energy, health, mobility, and more.

“We’ve put our trust in ClassOne for our entire wet processing line,” said Olaf Krüger, Head of FBH’s Process Technology Department. “They understand the special requirements of compound semiconductor manufacturers like us. ClassOne provides state-of-the-art automated processing tools for 100mm and smaller wafers that allow for high process reproducibility during R&D of novel compound semiconductor devices and ensure compatibility to industrial standards. Plus, they’ve put together a support operation right here in Europe to provide us with everything we need.”

“We see these follow-on orders from FBH as a real vote of confidence, and one that we value highly,” said ClassOne’s CEO Byron Exarcos. “Europe is an important market for us. Which is why we’ve invested heavily to build a world-class customer support structure here, including a strong, experienced process engineering team and a seasoned field service and support group that’s able to cover everything our customers might need, up to and including an extensive inventory of spare parts. So, it’s extremely gratifying to see our European customers really recognizing and making use of our local capabilities.”

“The investment is also paying off in terms of the market share gains we’re seeing,” said Roland Seitz, Director of ClassOne’s European Operations. “European customers continue to tell me ClassOne has moved into leading-supplier position for plating and wet processing equipment for 200mm wafers and below. It’s been the result of high-performance equipment combined with strong customer support and affordable prices. Going forward, the European sales of Solstice plating systems and associated tools are growing at a very rapid pace.”

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Micron delivers industry’s highest-capacity monolithic mobile memory for MediaTek’s newest Helio smartphone platform

Micron Technology, Inc., (Nasdaq: MU) a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek’s new Helio P90 smartphone platform reference design. Micron’s LPDDR4X is capable of delivering up to 12GB1 of low-power DRAM (LPDRAM) in a single smartphone device. By stacking up to eight die in a single package, it offers double the memory capacity without increasing the footprint compared to the previous generation product.

Use of enhanced mobile applications has accelerated consumer demand for compute and data-intensive attributes in handheld devices. This increase in demand has generated the need for high-value memory solutions that are capable of delivering the full potential of user features in next-generation smartphones. As the industry’s highest-capacity monolithic mobile memory, Micron’s LPDDR4X enables manufacturers of smartphones to deliver the benefits of high-resolution imaging, use of artificial intelligence (AI) for image optimization and multimedia features through its industry-leading bandwidth, capacity and power efficiency.

“Micron is committed to advancing the compute and data processing capabilities of smartphones and other edge devices, working with chipset vendors like MediaTek,” said Dr. Raj Talluri, senior vice president and general manager of the Mobile Business Unit at Micron Technology. “Our 12Gb monolithic LPDDR4X will unleash exciting new mobile applications in artificial intelligence and multimedia that will be further boosted by the availability of 5G.”

MediaTek’s Helio P90 smartphone chipset comes with the company’s most powerful AI technology to date — APU 2.0 — an innovative fusion AI architecture designed for powerful AI and gaming user experiences.

“MediaTek’s new Helio P90 smartphone platform delivers industry-leading performance for AI and imaging applications while maintaining power efficiency,” said Martin Lin, deputy general manager of MediaTek’s wireless communications business. “With its LPDDR4X, Micron supports our commitment to developing advanced technologies for smartphone platforms that enable richer mobile experiences.”

Micron LPDDR4X memory enables MediaTek to deliver the industry’s fastest LPDDR4 clock speeds and key improvements in power consumption to advance performance within mobile devices for next-generation applications. By achieving data rate speeds up to 4266 megabits per second (Mb/s) and delivering high density within a thin package, LPDDR4X is capable of meeting future needs of edge-AI data processing. High data rate speeds helps reduce data transaction workloads by performing machine learning on the device while still contributing to AI training in the cloud. As 5G mobile technology nears deployment, these capabilities will further enable more immersive and seamless experiences for mobile device users by supporting higher data rates and real-time data processing.

The new MediaTek Helio P90 smartphone chipset with Micron LPDDR4X technology will be incorporated into mobile devices and is expected to enter mass production in summer 2019.

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SST and SK hynix system ic partner to expand availability of embedded SuperFlash technology

IC designers are increasingly seeking ways to keep production costs down while implementing low power, high endurance embedded flash. Microchip Technology Inc. via its subsidiary Silicon Storage Technology (SST) has announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology. The partnership will introduce SST’s embedded SuperFlash technology to SK hynix system ic’s 110 nanometer (nm) CMOS platform, providing designers a cost-effective and low-power embedded flash memory solution. 

SST’s embedded SuperFlash technology offers low power, high reliability, superior data retention and endurance for a range of applications, such as Internet of Things (IoT) devices, smart cards and microcontroller-based applications. The technology’s power efficiency and fast erase time are ideal for low-power applications such as remote IoT edge nodes and contactless payment devices. 

 “The combination of area-efficient, low-power SuperFlash technology and the highly cost-effective 110 nm process node opens up exciting new product opportunities, especially for IoT and microcontroller-based applications,” said Mark Reiten, vice president of SST, a wholly owned subsidiary of Microchip. “This partnership will enable customers who require low power, high endurance embedded flash to keep their production costs down by using the highly optimised 8-inch CMOS platform.”

SST’s SuperFlash technology complements SK hynix system ic’s embedded flash memory solutions with low power and high reliability IP. SK hynix system ic is a fully owned subsidiary spun off from SK hynix (000660: Korea SE) in July 2017. It is a pure 200 mm foundry specialised in Display Driver IC (DDI), CMOS Image Sensor (CIS), and Power IC with a process range of 500 nm to 57 nm. 

“We believe that the adoption of SST’s embedded SuperFlash will enable SK hynix system ic to expand our technology portfolio, and it will help to respond to customer requests for highly reliable and robust embedded non-volatile memory solutions,” said Dr. SB You, marketing vice president of SK hynix system ic. “Moreover, we will provide customers with a cost-effective embedded flash solution to support their competitiveness in the market. As the demand for embedded flash memory solutions increases, there will be many customers coming to us to use our 110nm CMOS technology-based embedded flash memory solution.” 

The process development commenced earlier this year and is expected to be completed in early 2019. Contact SST for more information on the company’s extensive custom library of off-the-shelf IP blocks optimised for smartcard System-on-Chips (SoCs). 

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FO-WLP panel production becomes a reality

Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications. The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC. Future applications under consideration for panel production include application processors, memory and RF modules. TechSearch International, Inc. details these applications and analyzes monthly panel requirements and planned capacity. Supplier plans are discussed and consortia activities are highlighted.

One of the major market trends in wearable electronics is the shift to smartwatches, which have surpassed shipment numbers for wristbands. Package trends for wearable electronic products are analyzed, including Apple’s new smartwatch using TSMC’s InFO and Samsung’s Galaxy using FOPLP. The latest trends in augmented reality (AR) and virtual reality (VR) headsets are discussed. A detailed analysis of the change in packages from the previous generation HTC Vive VR system is presented.

A detailed analysis of the OSAT financials is provided with regional growth documented. Board and substrate material requirements for 5G applications are presented.

The latest Advanced Packaging Update is a 45-page report with full references and an accompanying set of 46 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on twitter @Jan_TechSearch

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Ferdinand-Braun-Institut chooses ClassOne for three additional wet processing tools

ClassOne Technology, global supplier of wet processing equipment for ≤200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany. In recent weeks, FBH ordered ClassOne’s high-performance 8-chamber Solstice® electroplating system. Now FBH is ordering three additional wet processing tools from ClassOne, including a refurbished Semitool®Spray Solvent Tool (SST), a Semitool Spray Acid Tool (SAT) and a Trident Spin Rinse Dryer (SRD). FBH is one of the world’s leading research institutes and a producer of III-V compound semiconductors, known for prototyping advanced microwave and optoelectronic devices for communications, energy, health, mobility, and more.

“We’ve put our trust in ClassOne for our entire wet processing line,” said Olaf Krüger, Head of FBH’s Process Technology Department. “They understand the special requirements of compound semiconductor manufacturers like us. ClassOne provides state-of-the-art automated processing tools for 100mm and smaller wafers that allow for high process reproducibility during R&D of novel compound semiconductor devices and ensure compatibility to industrial standards. Plus, they’ve put together a support operation right here in Europe to provide us with everything we need.”

“We see these follow-on orders from FBH as a real vote of confidence, and one that we value highly,” said ClassOne’s CEO Byron Exarcos. “Europe is an important market for us. Which is why we’ve invested heavily to build a world-class customer support structure here, including a strong, experienced process engineering team and a seasoned field service and support group that’s able to cover everything our customers might need, up to and including an extensive inventory of spare parts. So, it’s extremely gratifying to see our European customers really recognizing and making use of our local capabilities.”

“The investment is also paying off in terms of the market share gains we’re seeing,” said Roland Seitz, Director of ClassOne’s European Operations. “European customers continue to tell me ClassOne has moved into leading-supplier position for plating and wet processing equipment for 200mm wafers and below. It’s been the result of high-performance equipment combined with strong customer support and affordable prices. Going forward, the European sales of Solstice plating systems and associated tools are growing at a very rapid pace.”

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Micron delivers industry’s highest-capacity monolithic mobile memory for MediaTek’s newest Helio smartphone platform

Micron Technology, Inc., (Nasdaq: MU) a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek’s new Helio P90 smartphone platform reference design. Micron’s LPDDR4X is capable of delivering up to 12GB1 of low-power DRAM (LPDRAM) in a single smartphone device. By stacking up to eight die in a single package, it offers double the memory capacity without increasing the footprint compared to the previous generation product.

Use of enhanced mobile applications has accelerated consumer demand for compute and data-intensive attributes in handheld devices. This increase in demand has generated the need for high-value memory solutions that are capable of delivering the full potential of user features in next-generation smartphones. As the industry’s highest-capacity monolithic mobile memory, Micron’s LPDDR4X enables manufacturers of smartphones to deliver the benefits of high-resolution imaging, use of artificial intelligence (AI) for image optimization and multimedia features through its industry-leading bandwidth, capacity and power efficiency.

“Micron is committed to advancing the compute and data processing capabilities of smartphones and other edge devices, working with chipset vendors like MediaTek,” said Dr. Raj Talluri, senior vice president and general manager of the Mobile Business Unit at Micron Technology. “Our 12Gb monolithic LPDDR4X will unleash exciting new mobile applications in artificial intelligence and multimedia that will be further boosted by the availability of 5G.”

MediaTek’s Helio P90 smartphone chipset comes with the company’s most powerful AI technology to date — APU 2.0 — an innovative fusion AI architecture designed for powerful AI and gaming user experiences.

“MediaTek’s new Helio P90 smartphone platform delivers industry-leading performance for AI and imaging applications while maintaining power efficiency,” said Martin Lin, deputy general manager of MediaTek’s wireless communications business. “With its LPDDR4X, Micron supports our commitment to developing advanced technologies for smartphone platforms that enable richer mobile experiences.”

Micron LPDDR4X memory enables MediaTek to deliver the industry’s fastest LPDDR4 clock speeds and key improvements in power consumption to advance performance within mobile devices for next-generation applications. By achieving data rate speeds up to 4266 megabits per second (Mb/s) and delivering high density within a thin package, LPDDR4X is capable of meeting future needs of edge-AI data processing. High data rate speeds helps reduce data transaction workloads by performing machine learning on the device while still contributing to AI training in the cloud. As 5G mobile technology nears deployment, these capabilities will further enable more immersive and seamless experiences for mobile device users by supporting higher data rates and real-time data processing.

The new MediaTek Helio P90 smartphone chipset with Micron LPDDR4X technology will be incorporated into mobile devices and is expected to enter mass production in summer 2019.

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SST and SK hynix system ic partner to expand availability of embedded SuperFlash technology

IC designers are increasingly seeking ways to keep production costs down while implementing low power, high endurance embedded flash. Microchip Technology Inc. via its subsidiary Silicon Storage Technology (SST) has announced a strategic partnership with SK hynix system ic to expand the availability of SuperFlash® technology. The partnership will introduce SST’s embedded SuperFlash technology to SK hynix system ic’s 110 nanometer (nm) CMOS platform, providing designers a cost-effective and low-power embedded flash memory solution. 

SST’s embedded SuperFlash technology offers low power, high reliability, superior data retention and endurance for a range of applications, such as Internet of Things (IoT) devices, smart cards and microcontroller-based applications. The technology’s power efficiency and fast erase time are ideal for low-power applications such as remote IoT edge nodes and contactless payment devices. 

 “The combination of area-efficient, low-power SuperFlash technology and the highly cost-effective 110 nm process node opens up exciting new product opportunities, especially for IoT and microcontroller-based applications,” said Mark Reiten, vice president of SST, a wholly owned subsidiary of Microchip. “This partnership will enable customers who require low power, high endurance embedded flash to keep their production costs down by using the highly optimised 8-inch CMOS platform.”

SST’s SuperFlash technology complements SK hynix system ic’s embedded flash memory solutions with low power and high reliability IP. SK hynix system ic is a fully owned subsidiary spun off from SK hynix (000660: Korea SE) in July 2017. It is a pure 200 mm foundry specialised in Display Driver IC (DDI), CMOS Image Sensor (CIS), and Power IC with a process range of 500 nm to 57 nm. 

“We believe that the adoption of SST’s embedded SuperFlash will enable SK hynix system ic to expand our technology portfolio, and it will help to respond to customer requests for highly reliable and robust embedded non-volatile memory solutions,” said Dr. SB You, marketing vice president of SK hynix system ic. “Moreover, we will provide customers with a cost-effective embedded flash solution to support their competitiveness in the market. As the demand for embedded flash memory solutions increases, there will be many customers coming to us to use our 110nm CMOS technology-based embedded flash memory solution.” 

The process development commenced earlier this year and is expected to be completed in early 2019. Contact SST for more information on the company’s extensive custom library of off-the-shelf IP blocks optimised for smartcard System-on-Chips (SoCs). 

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FO-WLP panel production becomes a reality

Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications. The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC. Future applications under consideration for panel production include application processors, memory and RF modules. TechSearch International, Inc. details these applications and analyzes monthly panel requirements and planned capacity. Supplier plans are discussed and consortia activities are highlighted.

One of the major market trends in wearable electronics is the shift to smartwatches, which have surpassed shipment numbers for wristbands. Package trends for wearable electronic products are analyzed, including Apple’s new smartwatch using TSMC’s InFO and Samsung’s Galaxy using FOPLP. The latest trends in augmented reality (AR) and virtual reality (VR) headsets are discussed. A detailed analysis of the change in packages from the previous generation HTC Vive VR system is presented.

A detailed analysis of the OSAT financials is provided with regional growth documented. Board and substrate material requirements for 5G applications are presented.

The latest Advanced Packaging Update is a 45-page report with full references and an accompanying set of 46 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on twitter @Jan_TechSearch

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